Huawei công bố công nghệ hybrid bonding cho Kirin 2026
Huawei đã công bố chi tiết về quy trình hybrid bonding trong một bài báo khoa học mới, cho phép các SoC sử dụng thiết kế xếp chồng 3D. Công nghệ này giúp Huawei vượt qua hạn chế về thiếu quyền truy cập vào công nghệ lithography tiên tiến, đồng thời mang lại hiệu suất và băng thông tốt hơn cho Kirin 2026.
Being limited to older-generation DUV equipment hasn’t deterred Huawei’s efforts to develop and mass produce competitive chipsets, as the Kirin 2026 will be a prime example of the company’s next-generation packaging. Now, in the latest paper, the Chinese giant has detailed how a hybrid bonding process will allow for SoCs to flaunt a 3D stacking approach, which is the first step of removing one of the major obstacles of mobile silicon innovation; lack of access to advanced lithography. Despite having no access to advanced chipmaking equipment, Huawei’s mastery in smartphone chipset packaging for the Kirin 2026 looks promising During Huawei’s […] Read full article at https://wccftech.com/huawei-kirin-2026-paper-shows-hybrid-bonding-for-3d-stacking-to-boost-competition/